| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Nanoindentation Study of Sn and Bi Phases in Sn-Bi Alloys |
| Author(s) |
Xin Fu Tan, Viola Paul, Takahito Ohmura, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Xin Fu Tan |
| Abstract Scope |
Sn-Bi alloys are the prime candidates for low temperature solders. The mechanical properties of Sn-Bi alloys are known to be strain rate sensitive. This work investigates the mechanical properties and deformation behaviour of the Sn and Bi phases within a hypo-eutectic Sn-37wt%Bi alloy and a near-eutectic Sn-57wt%Bi alloy to understand their respective contributions to the overall mechanical properties using nanoindentation. Constant strain rate tests were performed at 0.01s-1, 0.1s-1 and 1s-1 to investigate the deformation of the Sn and Bi phases at different strain rates, with pure Sn and Bi as references. The hardness and elastic modulus of the phases are determined. The results show significant pop-ins in the Sn phase during loading, while the pop-ins in the Bi phase are less pronounced. The critical load for both phases is highly strain rate sensitive, ranging between approximately 10-500N and 10-100N for Sn and Bi, respectively. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, |