| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Materials Science for Global Development -- Health, Energy, and Environment: An SMD Symposium in Honor of Wole Soboyejo
|
| Presentation Title |
Impact of Immersion Cooling on Thermomechanical Properties of Extremely Low Loss Substrate Core |
| Author(s) |
Dereje Agonafer, TVS Venkateswar Vishnu, Rohit Suthar, Pratik Bansode, Rabin Bhandari, Akshay Lakshminarayana, Krishna Bhavana Sivaraju |
| On-Site Speaker (Planned) |
Dereje Agonafer |
| Abstract Scope |
Cooling of Information Technology Equipment (ITE) is responsible for approximately 33% of the overall energy consumption in conventionally air-cooled data centers. Even with significant improvements in efficiency using air-cooling such as direct and indirect evaporative heat exchangers, we are staring to approach air cooling limits its limits with the ability to accommodate higher rack inlet temperature up to 45. Sp-LIC is a suitable option and especially as the direct contact with all server components. Although thermal performance of Sp-Lic has been documented, there exists a scarcity of research pertaining to the reliability of immersion cooling. The determination of material properties, such as modulus and glass transition temperature, holds significant importance in the mechanical design of electronic components. In accordance with the Open Compute Project (OCP) design guidelines for immersion-cooled IT equipment, we will demonstrate traditional material compatibility tests from standards such as ASTM 3455 with necessary modifications. |
| Proceedings Inclusion? |
Planned: |