| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Influence of Indium Addition on Microstructural Properties of Sn-rich Solder Joints |
| Author(s) |
Amey Luktuke, Kumar Ankit, Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Amey Luktuke |
| Abstract Scope |
Composition of alloying elements in Sn-rich solder joints play a pivotal role in determining the microstructure, interfacial intermetallic (IMC) layer formation and the damage associated with thermal and electromigration stressing. Alloying of Indium and Sn can contribute to superior ductility, wettability, and fatigue resistance as opposed to conventional solders. However, the effects of Sn-In composition on the microstructure are not well understood. In order to study the effect of Indium content in Sn-rich solder, sandwich solder samples were fabricated with solder composition of Sn-2, 4, 6, 10 wt.% In. The samples were analyzed using scanning electron microscopy (SEM), electron backscatter diffraction (EBSD) and energy dispersive X-ray spectroscopy (EDS). The combination of these characterization techniques provided unique insights into the influence of Indium content on the solidification process after reflowing, the morphology of microstructure, interfacial IMC formation, grain size and the correlation between the grain boundaries and segregation of Indium. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |