| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Microstructure, Texture, and Properties Evolutions in Pure Nickel Metal Under High-density Electric Current Stressing |
| Author(s) |
Pao-Hsuan Yang, Hsuan-Cheng Huang, Meng-Chun Chiu, Chien-Lung Liang |
| On-Site Speaker (Planned) |
Pao-Hsuan Yang |
| Abstract Scope |
Nickel has been widely used in microelectronic packaging as a metallization layer. The microstructure and properties evolution of pure nickel or nickel-based alloy during the electric current stressing will affect the interconnect reliability and thus deserve a comprehensive investigation. In this study, the microstructures and textures of as-received and current-stressed pure nickel strips were investigated using an electron backscattered diffraction (EBSD) technique. With an increasing current density, severe grain growth after a critical current density of 3.2 × 10^4 A/cm^2 was observed, corresponding to a significant micro-hardness reduction of up to 35.2% and a 11.4% decrement in electrical resistivity. Moreover, current stressing induced increases in theΣ3 60°<111> face-centered cubic (FCC) annealing twin boundary fraction and the {001}<100> Cube texture fraction due to grain growth. A thermal annealing benchmark experiment was also conducted to investigate the contribution of the athermal effect of the current stressing. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Copper / Nickel / Cobalt, Characterization |