| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Understanding and Predicting Dynamic Behavior of Materials
|
| Presentation Title |
Twinning/Detwinning Behavior of Cu-Ta Trilayer Under Shock Loading Conditions at The Atomic Scale |
| Author(s) |
Marco Echeverria, Avinash M. Dongare |
| On-Site Speaker (Planned) |
Marco Echeverria |
| Abstract Scope |
The shock, spall failure behavior, and void nucleation response of multiphase metallic microstructures comprised of FCC/BCC phases are determined by the interplay between dislocation slip and deformation twinning. MD simulations indicate that deformation twinning has a contrasting response for Cu and Ta phases, where an increase of twin volume fraction in Cu results in an increase in spall strengths, whereas it decreases for Ta. Large MD simulations are carried out to investigate the role of interface structure and spacing of Cu/Ta interfaces on the spall strengths, and twinning/de-twinning behavior of Ta. The simulations comprise of tri-layer (Cu-Ta-Cu) alloys with layer thicknesses ranging from 100 nm to 500 nm to investigate the role of shock wave reflections at the interfaces in the Ta layer and the resultant spall response. The links between nucleation/growth of voids, dislocation evolution, and the role these play on the spall response of Cu-Ta alloys are presented. |
| Proceedings Inclusion? |
Undecided |