About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
|
Advanced Characterization Techniques for Quantifying and Modeling Deformation
|
Presentation Title |
Microstructural Evolution in OFHC Copper During Dynamic Tensile Extrusion: The Role of Temperature |
Author(s) |
Sara Ricci, Nicola Bonora, Gabriel Testa, Gianluca Iannitti, Andrea Ceccacci, Alberto Pagano, Andrew Ruggiero |
On-Site Speaker (Planned) |
Sara Ricci |
Abstract Scope |
When copper undergoes large plastic deformation, high temperatures and strain rates can promote dynamic recrystallization (DRX).
During the DTE test, the sample is dynamically extruded, with significant deformation exceeding 500%, high strain rates (1E5 – 1E6 /s) and temperature increase related to adiabatic heating. These conditions might promote DRX, resulting in microstructural modifications and evolutions that can directly impact the material's response and ability to withstand further deformation.
This study aims to evaluate the occurrence of DRX in Oxygen-Free High Conductivity (OFHC) copper during dynamic extrusion conditions and to examine the role of temperature conducting DTE tests at various test temperatures. The activity includes a systematic analysis of the material's microstructure to address microstructural changes during the deformation process and eventually identify the nucleation sites and evolution mechanisms of DRX. Additionally, numerical simulations are conducted to determine the conditions that might trigger this phenomenon. |
Proceedings Inclusion? |
Planned: |
Keywords |
Copper / Nickel / Cobalt, Characterization, Modeling and Simulation |