| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
Flux-Less Solder Ball Attachment Technology (FLAT) for Advanced BGA Assembly |
| Author(s) |
Dongjin Kim, Seonghui Han, Sang Eun Han, Dong-Gyu Choi, Kwansik Chung, Eunchae Kim, Sehoon Yoo |
| On-Site Speaker (Planned) |
Dongjin Kim |
| Abstract Scope |
This study introduces the Flux-Less solder ball Attach Technology (FLAT) for BGA packages. Unlike traditional methods that rely on flux to promote bonding by removing oxides, the FLAT process employs a three-stage approach: first, atmospheric pressure plasma is used to clean the pad surfaces, removing oxides; second, a liquid binder is applied to temporarily secure the solder balls in place; and third, the solder balls are reflowed using a laser. The FLAT method eliminates the need for flux and subsequent cleaning steps, thereby enhancing overall process efficiency and reducing environmental impact. Furthermore, the compact design of the FLAT equipment significantly reduces the required installation area to just 10% of traditional setups, facilitating more efficient use of the factory space. Comparative analysis with conventional flux-based methods demonstrates the exceptional performances of FLAT, highlighting its potential for BGA solder ball attachments by offering a cleaner, more efficient, and space-saving alternative. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Process Technology, Joining, Characterization |