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Meeting MS&T24: Materials Science & Technology
Symposium Solid-State Transformations Under Complex Thermal Conditions
Presentation Title Design and Function of a Nanocalorimetry Sensor for In-Situ TEM Imaging
Author(s) Lakshmi Ravi Narayan, William Alexander Osborn, Feng Yi
On-Site Speaker (Planned) Lakshmi Ravi Narayan
Abstract Scope In this work, a technique that combines nanocalorimetry with in-situ TEM imaging is presented. Nanocalorimetry utilizes chip-based sensors to perform thermal analysis at rapid rates, allowing for the characterization of far-from-equilibrium processes. For in-situ experiments, the 100 nm thick silicon nitride membrane on which the heating and temperature measurement circuitry is present is further thinned inside 5 µm by 5 µm windows to allow for electron transparency. Through these windows, the sample can be imaged during heating or cooling ramps in a TEM equipped with a high-speed camera. This combination allows for observations of the microstructural evolution to be directly linked to the thermal analysis. We demonstrate the use of this technique on microelectronic device materials but this technique is valuable to a wide range of materials and systems including those that are reactive, toxic, and radioactive due to the very small sample masses used, often 1 – 10 ng.

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A New Crystal Plasticity Modeling Framework Enabling Fully Implicit Time Integration of Coupled Phase Transformation and Plastic Deformation in Shape Memory Alloys
Additive Manufacturing of Beta Titanium Alloys: Influence of Thermo-Kinetics on Solid State Precipitation (Invited)
Design and Function of a Nanocalorimetry Sensor for In-Situ TEM Imaging
Effect of Partial Transformation Cycling on Transformation Behaviour of a Binary Nickel-Based Alloy
In-Situ Heating in Transmission Electron Microscopy to Characterize Nuclear Fuel
Multi-Stimuli Integration in Alloy Design: A Shear-Assisted Processing Approach for High-Performance Nano-Composite Materials
Predicting Emergence of Nanoscale Order in Surfaces Oxides Through Preferential Interactivity Parameter
Thermal Fatigue of Sn-Based Solders in Heterogenous Integration in Packaging (HIP) by Time-Resolved X-Ray Microscopy
Towards Predictive Microstructural Design of Additively Manufactured Metals
Using the SEAQT Framework to Predict the Kinetics of Irradiating an FeCr Alloy

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