About this Abstract |
Meeting |
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
Symposium
|
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
Presentation Title |
Leveraging Profilometry-Based Inspection Data to Capture Green-State Laminate Thickness of Automated Fiber Placement Structures |
Author(s) |
Nishan Patel, Ben Francis, Matthew Godbold, Ramy Harik |
On-Site Speaker (Planned) |
Nishan Patel |
Abstract Scope |
Automated Fiber Placement (AFP) revolutionizes composite manufacturing by offering precise, efficient, and scalable solutions for additively manufactured aerospace components. The ability to rapidly manufacture lightweight and high-performance structures cements AFP as a leading manufacturing process of the future. However, defects are bound to occur in the AFP process, affecting the mechanical properties especially when stacking occurs through the thickness. This stacking phenomena will affect the final part thickness, in turn requiring shimming operations to meet tolerance conditions. Developing computational methodologies to capture green-state thickness would enable prediction of post-cure thickness, ultimately increasing throughput by allowing engineers to plan for specific shimming operations. This work presents the development of a green-state thickness model of AFP manufactured components through captured inspection data. The Automated Composite Structure Inspection System (ACSIS) is utilized to construct the model. This system uses laser profilometry to scan the surface of a part, gathering topographical data to determine the height profile. By iteratively calculating the difference between initial and final scans at each point, thickness of the part build is obtained. To assess the accuracy of defect stacking predictions during process planning, the developed model is then compared to a preliminary thickness model created from gap and overlap predictions. The proposed inspection-based model not only provides an input for engineers for calculating post-cure part thickness, but also a stepping-stone towards more intensive computation for predicting defect interaction and morphology. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |