| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Modeling and Simulation of Pore Electromigration in Tin Solders |
| Author(s) |
Zachary J. Morgan, Yongmei Jin, Vahid Attari, Raymundo Arroyave |
| On-Site Speaker (Planned) |
Zachary J. Morgan |
| Abstract Scope |
Migration of pores in solder interconnects is a significant reliability concern for electronic devices. With dimensional shrinking of solder joints, anisotropic properties of solder materials play increasingly important roles in electromigration processes. Effects of property anisotropies on pore migration are investigated using phase field modeling and simulation of beta-tin polycrystals. The model accounts for mass diffusion due to charge conduction and stress gradient solving microscopic Ohm’s law and microelasticity equations. Simulations show pore velocity and path are not only impacted by local crystal orientation with respect to applied electric field, but also depend on property mismatches across grain boundaries and grain structure. Details of pore-pore interactions and pore-grain boundary interactions are also revealed in the simulations. Results are analyzed in terms of the microstructure-dependent internal electric field and stress gradient. Findings provide insight into the roles of anisotropic properties and grain microstructures in performance and degradation of tin solder alloys. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |