About this Abstract |
Meeting |
2025 TMS Annual Meeting & Exhibition
|
Symposium
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Alloys and Compounds for Thermoelectric and Solar Cell Applications XIII
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Presentation Title |
Simulations of Flexible Thermoelectric Coolers (f-TECs) for Enhanced Cooling Performance and Temperature Control |
Author(s) |
Ching-Chun Tseng, Chien-Neng Liao |
On-Site Speaker (Planned) |
Ching-Chun Tseng |
Abstract Scope |
The development of flexible thermoelectric coolers (f-TECs) presents a potential solution for managing the thermal environments of electrical devices. By converting electricity into a temperature difference, f-TECs can effectively cool electronic components, ensuring optimal operational temperatures. This technology is particularly advantageous for wearable devices and for supporting the intermittent energy consumption of remote wireless sensors. In this work, we focus on the simulation of temperature behavior, cooling capacity, and the influence of thermoelectric leg thickness, ranging from bulk to thick film. Our simulations also include composite barrier metallization between the Cu electrode and the thermoelements, enhancing the practical applicability of the results. Detailed simulations provide insights into the efficiency and feasibility of f-TECs in various application scenarios. Our findings underscore simulations of thick film thermoelements behavior and incorporating composite barriers to maximize cooling performance and precise temperature control, ensuring the reliability and efficiency of modern electronic devices. |
Proceedings Inclusion? |
Planned: |
Keywords |
Energy Conversion and Storage, Modeling and Simulation, Sustainability |