| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Microstructural Evolution and Shear Strength of Nano-Ag Paste Joints With Variable Sintering Temperatures and Particle Sizes |
| Author(s) |
Changcheng Zheng, Roman Bolzowski, Ming Liu, Dekui Mu, David P. Yan |
| On-Site Speaker (Planned) |
Dekui Mu |
| Abstract Scope |
This study prepared two types of nano-Ag paste to investigate the effects of varying sintering temperatures and nano-Ag particle sizes on the microstructure and shear strength of Ag/nano-Ag paste/Ag joints. Results showed that higher sintering temperatures improved densification and shear strength. The 70 nm Ag joints had higher densification and shear strength than 20 nm Ag joints, attributed to the higher stacking density and better densification diffusion of the 70 nm particles. The nano-Ag pastes exhibited excellent thermal conductivity at 220°C. Shearing tests at 250°C and after 500 hours of aging at 250°C showed a decrease in shear strength, though still above 30 MPa, due to atomic diffusion at grain boundaries and coarsening of the sintered structure. The influence of 20 nm and 70 nm Ag particle sizes on the sintering mechanism was further analyzed using hot-nanoindentation. These findings highlight nano-Ag paste's potential for die attachment in electronic power devices. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Joining |