| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
2025 Technical Division Student Poster Contest
|
| Presentation Title |
SPU-3: Copper Metallizations via Micro-Vacuum Cold Spray |
| Author(s) |
Thomas V. Hands, Paul Fuierer |
| On-Site Speaker (Planned) |
Thomas V. Hands |
| Abstract Scope |
Electronic components and circuits are being additively manufactured using a variety of print methods that require liquid vehicles and inks. This research created copper metallizations, by micro-vacuum cold spray, for use with functional ceramics created by dry aerosol deposition using the same custom-built apparatus. Gas atomized copper feedstock powder was sprayed onto various substrates, including glass and silicon. Simple and complex line patterns were made both with and without masking. Microstructural features consistent with cold spray were observed via electron microscopy. Line width and thickness, measured using optical profilometry, ranged from 0.3 to 1 mm and 0.1 to 3 microns respectively. Sheet resistivity was measured using a four-point probe I-V method. Based on nominal sheet resistivity and thickness, an approximate volume resistivity of 500 nano-Ohmmeters was calculated, rivaling the best fired on copper inks and within and order of magnitude of bulk copper. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Additive Manufacturing, Electronic Materials, Powder Materials |