| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Additive Manufacturing and Innovative Powder/Wire Processing of Multifunctional Materials
|
| Presentation Title |
Effect of Interpass Cooling Temperature on Microstructure and Mechanical Properties by WAAM Process Using Steel Wire |
| Author(s) |
Changwook Ji, Chung-Soo Kim |
| On-Site Speaker (Planned) |
Changwook Ji |
| Abstract Scope |
The WAAM process is a 3D-printing technology that uses arc heat to melt supplied metal wire and deposit it in a three-dimensional form. The advantage of this process is a relatively faster deposition rate than PBF and L-DED processes. These advantages can effectively reduce deposition time and cost. The WAAM process can be applied to industries like Aeronautical & Space, shipbuilding, and automobiles, but it has the disadvantage of low mechanical properties because the deposited metal has a large grain size. Therefore, research on cooling effects and methods in this process is necessary to compensate for low mechanical properties.
In this study, three commercially available low-cost steel solid wires were selected. The optimal deposition conditions and wire were selected based on the range of current and travel speed. The microstructure and mechanical properties were compared and analyzed in detail to compare the effects of cooling temperature during the WAAM process. |
| Proceedings Inclusion? |
Planned: |