| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Mechanisms of Electromigration in Bicrystal Sn Solder Joint by Correlative X-ray Tomography and Microscopy |
| Author(s) |
Marion Z. Branch Kelly, Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Nikhilesh Chawla |
| Abstract Scope |
Electromigration-driven void and intermetallic growth are critical reliability concerns for solder joints in microelectronic devices. Grain orientation and grain boundary density play an important role in determining the rate of damage evolution due to the anisotropic diffusion of copper in tin. However, little attention has been paid to determining the effect of grain boundary character on intermetallic growth. In this study, a bicrystal solder joint with two grain boundary types, twins and high angle boundaries, was studied during interrupted electromigration testing. Microstructure and grain orientation were characterized using scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD). X-ray microtomography scanning facilitated the quantification of intermetallic and void growth rates. The interrupted tomography scans captured the complex intermetallic and void evolution. SEM and EBSD analysis in parallel with tomography contributed to unique insight into the relationships between grain orientation, grain boundaries, and intermetallic growth and morphology. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |