| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Solid-State Diffusion Bonding of Metals and Alloys
|
| Presentation Title |
Preserving bond strength in solid state diffusion bonding of Inconel 718 |
| Author(s) |
Reggie Angell, Leila Ladani, William Nickerson |
| On-Site Speaker (Planned) |
Reggie Angell |
| Abstract Scope |
Creep resistant super-alloys such as Inconel 718 were developed to be used in aerospace applications. Inherently these alloys are difficult to bond using diffusion bonding method, as diffusion is the main mechanism of creep. Grain growth and Ostwald ripening occurring during high temperature diffusion bonding have detrimental effects on mechanical properties of these bonds. An experiment is conducted to achieve solid state diffusion bonding by controlling temperature, pressure and surface characteristics. Inconel 718 was bonded in a vacuum hot press furnace in an experiment varying these parameters followed by a precipitation heat treatment in accordance with AMS2774 condition S1750DP. Bonded samples were compared against Inconel 718 heat treated to the S1750DP condition. Initial experiments show coalescence is achieved with bonding temperature of 1225°C for 4 hours and 8 hours. Tensile values for bonds were approximately 20% lower than the base material. Microstructural analysis indicates large grains and undesired precipitate growth. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Process Technology, Mechanical Properties |