| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
|
| Presentation Title |
3D printing of composites with controlled micro/macrostructure design for electronic packaging |
| Author(s) |
Hortense Le Ferrand |
| On-Site Speaker (Planned) |
Hortense Le Ferrand |
| Abstract Scope |
Lightweight electronic packaging providing mechanical protection, cooling ability, and customizable electromagnetic interference (EMI) shielding effectiveness (SE) is needed for next-generation electronics. In this study, the deliberate micro/macrostructure precise design of graphite-based materials using magnetically assisted 3D printing allows the tuning of the EMI SE in the X band (8-12 GHz), leading to a maximum total shielding performance of 90 dB. Aligning high-density graphite microplatelets during the 3D printing also remarkably amplifies by 200 % the total SE. Subsequently, rationally designing the oriented microstructure within a geometrical shape increases the reflection and improves the EMI SE from 40 dB to 60 dB in a specific direction. Our proof-of-concept samples demonstrate the potential of micro/macrostructure precise design for customizing and enhancing electronic packaging EMI SE while achieving good heat dissipation and mechanical protection, using a versatile 3D printing method. These advances pave the way for more reliable and safer electronic systems. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Composites, |