| About this Abstract |
| Meeting |
6th World Congress on Integrated Computational Materials Engineering (ICME 2022)
|
| Symposium
|
6th World Congress on Integrated Computational Materials Engineering (ICME 2022)
|
| Presentation Title |
Numerical Study on a Heat Transfer Model in the Solid-Carbon/Liquid-Copper-Silicon System |
| Author(s) |
Khurram Iqbal, Attra Ali |
| On-Site Speaker (Planned) |
Khurram Iqbal |
| Abstract Scope |
The thermal conductivity of solid carbon and liquid copper-silicon by using Fourier law, can be utilized as a viable technique to grow superior warm administration materials. The investigation reveals that the thermal conductivity of C/Cu composites changes because of the SiC relocation from the matrix to the interface. C/Cu composites were used to predict the value of heat flux at different thicknesses of SiC materials. Several studies on heat transfer coefficients in the literature which is mostly experimental and little fundamental theoretical work has been done. The possible reasons for this gap might arise from the difficulties of studying the high-temperature and vacuum conditions. A model for the numerical simulation of heat transfer in the solid-carbon/ liquid copper-silicon system is presented. |
| Proceedings Inclusion? |
Definite: Other |