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Meeting 2020 TMS Annual Meeting & Exhibition
Symposium Solid State Diffusion Bonding of Metals and Alloys
Presentation Title The Role of Interface Microstructure and Chemistry on the Bond Strength of Aluminum 6061 HIP-bonded Samples
Author(s) Rajib Kalsar, Brady McBride, Rick W Shimskey, Kester D Clarke, Nicole R Overman, Curt A Lavender, Kenneth I Johnson, Vineet V Joshi
On-Site Speaker (Planned) Rajib Kalsar
Abstract Scope Low-enriched uranium (LEU) alloyed with 10 wt% molybdenum (U-10Mo) has been identified as a promising alternative to high-enriched uranium (HEU) for the United States High Performance Research Reactors (USHPRR). The nominal configuration of the U-10Mo plate-type fuel is a metallic U-10Mo fuel foil, the thickness of which varies from 0.6 mm (0.025") to 0.2 mm (0.0085") depending on the reactor; a 25 μm thick Zr interlayer–diffusion barrier on either side, and an outer cladding of 6061 aluminum. The aluminum cladding is usually performed using the HIP process. In the present work, the role of interface microstructure and chemistry on the bond strength of Al-6061 alloy bonded by hot isostatic pressing (HIP) was investigated. The impact of different HIP parameters such as temperature, surface preparation, surface texture and strong-back materials on bond strength was investigated. Interface microstructures were characterized to quantify the oxide layer thickness, Mg2Si fraction and interface recrystallization.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Anisotropic Grain Growth in Cu Joints at Low Temperatures by <111>-oriented Nanotwinned Copper Films
Bulk-state Reaction for Synthesizing Bulk Hybrid Alloys through High-pressure Torsion
Diffusion Bonding of AgC-Cu Bi-Layered Electrical Contacts
Diffusion Bonding of Ti-6Al-4V Alloy to Interstitial Free (IF) Steel Using Copper and Nickel Interlayers
Instant Copper Direct Bonding Using <111>-oriented Nanotwinned Cu Microbumps
Interfacial Recrystallization and Element Diffusion during the Hot Compression-bonding of Ti-6321 to TC4
Mechanical Characterization of Diffusion Bonded Alloy 800H
Mechanical Performance of Diffusion Bonded 316 Stainless Steel for use in a Hybrid Compact Heat Exchanger
Microstructural Characterizations and Mechanical Properties of Diffusion Bonded Stainless Steel 316H and Inconel 800H
Microstructural Evolution and Mechanical Properties of Lap-jointed Ti-6Al-4V Plates by Pin-less Friction Stir Spot Welding
Microstructure Evolution and Mechanical Properties of Diffusion Bonded Ti6Al4V Alloy Joints for Aerospace Applications
Modeling Strength of Diffusion Bonded Interface Using Phase-Field Recrystallization and Creep-Damage Models.
MTI Low Force Friction Welding
Multi-Scale Study Of Bonding Mechanism Between Immiscible Mg/Steel Alloys
O-49: Joining of 14YWT Ferritic ODS Alloys by Spark Plasma Technique
O-50: Optimization and Prediction of Bond Characteristics of Ti6Al4V Diffusion Bonded Joints through RSM
Solid-state Diffusion Bonding of Glass-metal for the International Thermonuclear Experimental Reactor (ITER) Diagnostic Windows
Solid State Joining of Dissimilar Ni-based Superalloys Using Field Assisted Sintering Technology
Tensile Performance of Diffusion Bonded Haynes 230 Alloy for use in a Compact Heat Exchanger
The Role of Interface Microstructure and Chemistry on the Bond Strength of Aluminum 6061 HIP-bonded Samples

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