About this Abstract |
Meeting |
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
Symposium
|
2024 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2024)
|
Presentation Title |
Multi-Laser Powder Bed Fusion of Cu10Sn Using Low-Power 450 nm Diode Lasers |
Author(s) |
Erhan Cetin, Alkim Aydin, Kamran Mumtaz |
On-Site Speaker (Planned) |
Alkim Aydin |
Abstract Scope |
Using 450 nm diode lasers significantly increases the absorptivity of copper in laser processing compare to traditional laser powder bed fusion (LBPF) with 1064 nm due to its nature. According to literature reviews, processing copper with 450 nm diode laser drastically increases the absorptivity from 5% to 65% (13 times higher) compared to conventional LBPF. Therefore, high wavelength powerful LBPF systems such as SLM limit the potential usage of copper. With this motivation, in this study, Cu10Sn powder was used via diode area melting additive manufacturing technique using low wavelength diode laser. Different hatch distances, velocities, and layer thicknesses were chosen as process parameters. The mechanical properties of samples were examined with an optical microscopy and hardness tester in addition to density calculation with image analysis. This research revealed that using low-wavelength diode laser sources in laser processing with copper validates superior mechanical features and high-density parts. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |