| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
In-situ Characterization of Electrical Current Induced Structural Changes in Single-Phase η-Cu6Sn5 Using Synchrotron Radiation |
| Author(s) |
Shubhayan Mukherjee, Shih-kang Lin |
| On-Site Speaker (Planned) |
Shubhayan Mukherjee |
| Abstract Scope |
In recent electronic packaging, ensuring material stability under high electric currents is crucial. A major concern is the formation of intermetallic compounds like Cu6Sn5 in the Cu-Sn solder joint, which can significantly impact electronic device reliability. Cu6Sn5 forms in two phases: the high-temperature hexagonal η phase and the low-temperature monoclinic η' phase, with a transition temperature (η' ↔ η) of 186 ℃. In our previous research, we investigated the structural behavior of η'-Cu6Sn5 under electrical current stress. To understand the growth kinetics, this study focuses specifically on characterizing the as-prepared single-phase hexagonal η-Cu6Sn5 in the presence of electrical current. We employed in-situ synchrotron radiation-based X-ray diffraction (XRD) to analyze structural changes influenced by electrical current density, particularly focusing on lattice parameters. Simultaneously, transmission electron microscopy (TEM) was used to experimentally observe and validate the structural variations of hexagonal η-Cu6Sn5 under electrical current stress. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |