| Abstract Scope |
Flexible and wearable electronics requires that the adhesion energy of metal films adhere to polymer substrates. In this work, tensile induced delamination is used to quantify the adhesion energy of Mo-based films on polyimide, a common electrode material system found in thin film transistor displays. Three different approaches to modify the interface to tailor the adhesion energy will be compared, namely (i) the use of metallic interlayers between Mo and Polyimide (Al, Ta), (ii) the use of alloy interlayers between Mo and Polyimide (MoAl, MoTa), (iii) and the use of an alloyed Mo film (MoAl, MoTa) without an interlayer. Experiments on the different samples were performed with in-situ resistance measurements, CLSM, and XRD. Results show that only the use of metallic interlayers between Mo and Polyimide (Al, Ta) provide a significant increase in the calculated adhesion energy compared to any of the other modification strategies. |