| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIX
|
| Presentation Title |
In-situ Study of Electrochemical Migration of Tin in Presence of Contaminants |
| Author(s) |
A.S.Md Abdul Haseeb, Ee Lynn Lee, Yi Sing Goh, Y. H. Wong, M. F. M. Sabri, B. Y. Low |
| On-Site Speaker (Planned) |
A.S.Md Abdul Haseeb |
| Abstract Scope |
As the pitch size in electronic packages decreases due to miniaturization, problems related to electrochemical migration (ECM) become a serious reliability concern. ECM is an electrochemical reaction that occurs in presence of electrolyte and bias voltage, causing metallic components to dissolve at the anode and redeposit at the cathode in the form of dendrites leading to short circuit failure. Contaminants originating from manufacturing process steps, flux residue and environment accelerate the process. This work investigates ECM process of tin in the presence of different contaminants e.g., bromide and adipic acid. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under a high-power optical microscope for the in-situ investigation. The products of ECM such as dendrites and precipitates were characterized by SEM/ EDX and XPS. The effects of different contaminants on the mean time to failure and the mechanism of ECM are discussed. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |