| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Sn-Bi Solder Alloys With Sb and Ag Additions: Effect of Microstructure on Mechanical Properties |
| Author(s) |
Lijia Xie, Hannah Fowler, Sean Lai, Ganesh Subbarayan, John Blendell, Carol Handwerker |
| On-Site Speaker (Planned) |
Lijia Xie |
| Abstract Scope |
Low Temperature, lead-free solder alloys are widely used in advanced packaging, providing good mechanical and electrical connections. The lower melting point of Sn-Bi alloys reduces reflow temperatures by over 70°C from Sn-Ag-Cu alloys, thus reducing board warpage during reflow and warpage-induced processing defects. Understanding the effects of alloying elements on mechanical reliability is important in low temperature alloy design and lifetime predictions under different service conditions.
In this talk, we report on the results from monotonic shear tests and creep tests of Sn-58Bi near-eutectic alloys as a function of Sb and Ag concentration, aging conditions and test conditions. We will focus on relating the microstructural origins of the effects of Sb and Ag additions in increasing peak stress and producing significant strain softening after the peak stress. Similar analyses will be presented on the transitions between secondary and tertiary creep as a function of alloy composition, aging, and test conditions. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, Other |