| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Solid State Diffusion Bonding of Metals and Alloys
|
| Presentation Title |
Modeling Strength of Diffusion Bonded Interface Using Phase-Field Recrystallization and Creep-Damage Models. |
| Author(s) |
Aritra Chakraborty, Andrea Rovinelli, Mark C. Messner, T.L. Sham |
| On-Site Speaker (Planned) |
Andrea Rovinelli |
| Abstract Scope |
Diffusion bonding is a promising alternative to other welding techniques for joining of high-strength refractory materials that are frequently used in aerospace and nuclear industries, because of the low residual stresses developing at the joined interface and excellent oxidation resistance. Since the process generally operates at elevated temperatures and pressure (stresses), it leads to dynamic recrystallization at the bonded interface, which can then significantly affect the strength of the bonded material. In this work, the process of dynamic recrystallization at this bonded interface is modeled using phase-field modeling implemented in the multi-physics software MOOSE. Following the phase-field simulations, the creep strength of the interface resulting from the diffusion bonding process is analyzed via crystal plasticity simulations. The effect of grain boundary cavitation damage is included in the simulations utilizing a discontinuous Galerkin cohesive zone approach. Results show the importance of the interface microstructure to achieve the optimal interface strength. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |