| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
|
| Presentation Title |
A Comprehensive Study of Microstructure, Texture, and Properties Evolutions in Pure Metals Induced by Electric Current Stressing |
| Author(s) |
Chien-Lung Liang, Hsuan-Cheng Huang, Meng-Chun Chiu, Pao-Hsuan Yang, Su-Chen Liao |
| On-Site Speaker (Planned) |
Chien-Lung Liang |
| Abstract Scope |
Electric current stressing of the metallic constituents in electronic devices may affect the microstructure and texture and further change the material properties during the operation before the electromigration-induced failure. Herein, we presented the effects of current stressing on the microstructure, texture, and electrical and mechanical properties of pure Cu, Ag, Ni, and Fe metallic systems. These metals are the primary constituents commonly used in interconnection, metallization, or lead frame materials. Current stressing experiments were designed with different current densities for a fixed 1 h duration. The current-induced recrystallization and grain growth phenomena will be introduced to explain the variations in mechanical and electrical properties. The evolutions in grain size, texture, misorientation, geometrically necessary dislocation density, and crystallinity will be revealed by electron backscattered diffraction (EBSD) and X-ray diffraction (XRD) analyses. Thermal benchmark experiments were also conducted to clarify the thermal and athermal contributions from the current stressing. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Mechanical Properties, Characterization |