| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Low Temperature Cu-Cu Bonding by Copper-based Paste with Small Amount Sn Additive |
| Author(s) |
Kuo-Shuo Huang, Wei Liu, Albert T. Wu |
| On-Site Speaker (Planned) |
Kuo-Shuo Huang |
| Abstract Scope |
The increasing demand of wide-bandgap semiconductors power devices prompts the development of high temperature bonding methods. Because the conventional solder joints are not allowed to operate over 150 oC, the bonding by sintering micro- or nano-sized particles become the most promising way for requirements. Silver sintering technique has been proposed but the high cost and poor electromigration resistance limit its applications. In addition, the densification issue by sintering that would affect the electrical and mechanical properties of joints remains unsolved. In this study, by means of high diffusion rate between Cu and Sn atoms, small amount of Sn would be added into copper-based paste that is composed of Cu particles and organic solvent. The Cu-Sn paste would be used to bond two Cu plates. The microstructure and mechanical properties of the bonding are investigated. The optimized conditions are studied by varying the amount of additive, the bonding temperature and time. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |