| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIII
|
| Presentation Title |
A-28: Cu Surface Protection Treatments for Anti-oxidation and Anti-corrosion |
| Author(s) |
Ting Yu, Chih-Ming Chen |
| On-Site Speaker (Planned) |
Ting Yu |
| Abstract Scope |
Due to excellent electrical and thermal conductivities, copper is one of the important metal materials widely used in the electronic industry. However, copper suffers unavoidable oxidation and corrosion problems when it is stored in ambient condition. Excessive oxidation and corrosion destroy the material structure and increase the electrical resistance, significantly affecting the quality and efficiency of signal transmission and resulting in the failure of electronic components. To solve the oxidation and corrosion problem, a molecule nanolayer constructed by well-organized organics is adsorbed on the copper surface as the protective layer. Cyclic voltammetry and X-ray diffractometer are used to analyze the efficacy of the molecule protective layer. X-ray photoelectron spectroscopy is used to acquire the chemical property and binding information of the molecule layer on the Cu surface. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Thin Films and Interfaces, |