| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
| Presentation Title |
Interface Design for Flexible Thin Film Systems: Electromechanical Properties and Adhesion |
| Author(s) |
Johanna Byloff, Pierre-Olivier Renault, Damien Faurie, Soheil A. Husain, Thomas E. J. Edwards, Daniele Casari, Claus Trost, Megan Cordill, Barbara Putz |
| On-Site Speaker (Planned) |
Johanna Byloff |
| Abstract Scope |
In the Al-Polyimide (PI) system, favourable adhesive properties are attributed to an amorphous Al-O-C interlayer (5 nm) at the interface between metal film and polymer substrate. We mimic this interlayer artificially (Al2O3, 0.12 - 25 nm) using combined atomic layer (ALD) and physical vapour deposition (150 nm Al), to uncover fundamental mechanisms behind reported electromechanical benefits. Annealed (400 °C, 90 min) and as-deposited samples were loaded in uni- and equi-biaxial tension, with in-situ film stress and electrical resistivity measurements tracking the deformation behaviour as a function of interlayer thickness. Adhesion energies were determined using the tensile induced delamination (TID) method. Al films with an artificial ALD-Al2O3 interlayer exhibit higher adhesion energy, as well as reduced roughness and grain width in the sputtered Al layer. This results in a 30% higher electronic failure strain and yield stress, proving that our interface design approach improves electromechanical performance of the whole system. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Thin Films and Interfaces, Aluminum, Mechanical Properties |