About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Different Electroplating Temperature Affecting on Mechanical Strength of Highly (111) Preferred Orientated Nanotwinned Copper (TMS 2020) |
| Author(s) |
Chen Fu-Chian, Chih Chen |
| On-Site Speaker (Planned) |
Chen Fu-Chian |
| Abstract Scope |
Recently, highly (111) preferred orientated nanotwinned copper (nt-Cu) has been studied for potential applications in electronic packaging and lithium ion batteries. The mechanical strength of nt-Cu is almost the same as commonly used Cu alloys, but nt-Cu provides better electrical conductivities, which is a great advantage for application in electronic devices.
Some applications in 3D-IC require high strength, high thermal stability and well electromigration resistance. It is reported that nt-Cu possesses all the characteristics. In this study, three different electroplating temperatures are used to electroplate nt-Cu: 15°C, 25°C and 35°C. We used a tensile tester to measure the UTS (Ultimate tensile strength) and elongation of each sample. By controlling the electroplating parameters, we can electroplate nt-Cu with different strength, ranging from 700MPa after 150 °C annealing for 1h. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |