| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
The Relation Between the Microstructure and Properties of SnAgCu/SnBiAg Mixed Assemblies, and Thermal History |
| Author(s) |
Eric J. Cotts, Mohammed Genanu, Faramarz Hadian |
| On-Site Speaker (Planned) |
Eric J. Cotts |
| Abstract Scope |
Pb-free solders containing solid substitutional elements (e.g. Bi) offer promise for more stable solder joint strength and better reliability performance. Mixed assembly SAC/Bi-Sn solder joints (e.g., SAC305/Sn57Bi1Ag) provide lower temperature assembly for a wide range of conditions. The changes in microstructure of these mixed assemblies during reflow (140oC to 215oC) depend upon the peak temperature, TP, and on the initial ratio of the volume of the SnBiAg paste to the volume of the SnAgCu solder ball. In fact, the final volume ratio between the volumes of the SnAgCu and SnBiAg phases can be predicted as a function of the peak reflow temperature, as can the Ag and Bi distributions in the resulting solder joints. These calculations are reported, and compared to results from investigations of microstructure, and to measurements of mechanical properties (such as shear strength) as a function of peak reflow temperature and of initial volume ratio. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |