About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior at the Nanoscale VI
|
| Presentation Title |
Understanding the Local Structure-property Relationships of Pb-Sn Solders in Terrestrial vs. Microgravity Environments |
| Author(s) |
Manish Kumar, Sid Pathak |
| On-Site Speaker (Planned) |
Manish Kumar |
| Abstract Scope |
We characterized the microstructure and resultant micro-to-nanomechanical response of solders in terrestrial vs. microgravity environments, 1g vs. ~1×10-5g. The In-Space Soldering Investigation (ISSI) experiments performed aboard the International Space Station (ISS) have shown that soldering in microgravity is expected to be considerably different than their ground-based counterparts due to Earth’s natural convective flow and buoyancy effects being minimized in microgravity during melting and solidification. Using Lead(Pb)-Tin(Sn) solders from the ISSI, we demonstrate how the lack of Earth’s natural convective flow and buoyancy effects during melting/solidification onboard the International Space Station affects its microstructure and performance. Our current scanning electron microscope (SEM) imaging results demonstrate a considerable amount of internal porosity (about three times that of ground-based solder) and inhomogeneous vs. homogeneous distribution of the Sn-rich and Pb-rich regions of the terrestrial vs. microgravity solders, respectively. We also observed a lower strength in the microgravity solders from nanoindentation testing. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Solidification, |