| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Effect of Solder Joint Geometry on Electromigration Failure Mechanism in Micro Solder Joint |
| Author(s) |
Hossein Madanipour, Yi Ram Kim, Allison Theresa Osmonson, Choong-Un Kim |
| On-Site Speaker (Planned) |
Hossein Madanipour |
| Abstract Scope |
Electromigration failure mechanisms impacted by microsolder joints with differing joint geometry, specifically a comparison of various solder joint aspect ratios (length to height), is investigated in this research. Unlike in large scale solder joints, like those used in a ball grid array (BGA), electromigration in microsolder joints competes with the diffusion induced conversion of Sn to IMC phases. In such cases, electromigration failure does not necessarily follow the known kinetic mechanism and instead exhibits a much more complex dependence on the current and temperature. Our study, using ~20um thick solder with 2 different geometries under varying electromigration test conditions, shows that the mechanisms behind electromigration failure are related to Sn self-diffusion, intermetallic compound conversion and also surface diffusion which is more active in joints having lower aspect ratios. Our result produces evidence supporting that electromigration failure can be inhibited under some conditions due to rapid conversion of Sn into IMCs. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |