| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
|
| Presentation Title |
High-Strength and High-Conductivity Nanotwinned Copper Foils Via Cu-Ni Co-Electrodeposition |
| Author(s) |
Kang Ping Lee, Chih Chen |
| On-Site Speaker (Planned) |
Kang Ping Lee |
| Abstract Scope |
Nanotwinned copper (NT-Cu) has drawn significant attention due to its higher mechanical strength and similar resistivity to bulk copper. This is attributed to the numerous twin boundaries in NT-Cu, which, like grain boundaries, impede dislocation motion and enhance strength. NT-Cu has been extensively studied as a promising material for integrated circuit packaging. We utilized direct current deposition to incorporate nickel atoms in NT-Cu foils during deposition. We adjusted the Ni ion concentration to achieve the best mechanical properties (Ultimate tensile strength: 743 MPa, Yield Strength: 573 MPa, Elongation: 3.5%, IACS: 79%). Copper and nickel readily form a solid solution due to their identical crystal structure, thereby enhancing NT-Cu’s mechanical performance while maintaining high conductivity and resistance to electromigration. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Electronic Materials, Mechanical Properties |