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Meeting 2021 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
Presentation Title Introductory Comments: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
Author(s) Sinn-wen Chen
On-Site Speaker (Planned) Sinn-wen Chen
Abstract Scope Introductory Comments
Proceedings Inclusion? Planned:

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Change in Electric Resistance of Conductive Pastes Including Ag Particles Coated with Various Higher Fatty Acids during Curing Process
Effect of Initial Volume Ratio and Reflow Temperature on the Microstructure of SnBiAg-SAC Mixed Solder Joints
Effect of Low Bi Content on Mechanical Property of Sn-Bi-Zn Alloy before and after Thermal Aging
Effects of Bromide and Adipic Acid on Electrochemical Migration of Tin
Electric Current Effect on the High-strain-rate Deformation of AA7075-T6 Al-alloy
Electroplating of NiP for the Low Residual and High Strength MEMS Probe Tip
High-throughput Calculations for Sn-Bi-Ag and Sn-Bi-Ag-In Low-temperature Lead-free Solders
IMC-free Low-temperature TLP Cu-to-Cu Interconnection with Excellent Thermal Stability
Interfacial Microstructure Evolution of Ag/ENIG and Ag/Cu Joint under Thermal Aging
Interfacial Reactions in the Bi2Te3 Thermoelectric Modules
Intermetallic Reactions and Interfacial Stability in Cu-Co-Sn System
Introductory Comments: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XX
Machine Learning for Perovskite Phase Stability
Review of X-ray Microbeam Study of Electromigration
Solid-Liquid Interdiffusion (SLID) Bonding; For Thermal Challenges in Microsystem Bonding
Solid-liquid Interfacial Reaction between Cu and In-48Sn Alloy
Study on the Phase Diagrams of Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) Systems
Synchrotron White Laue Nanodiffraction Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5
Synthesis and Characterization of Silver Tin Alloy Powders by High Energy Ball Milling
The Microstructure and Properties Variations of Sn-coated Cu Wires Induced by Electromigration
The Significance of Transport Electronic Entropy in VO2
Thermomigration Failure Induced by Surface Diffusion of Sn on Ni/Cu Metallization in Microbumps for 2.5-dimensional Integrated Circuits Packaging
Towards Predictive Solid-state Synthesis: Understanding Phase Evolution during the Formation of YBCO
Using Machine Learning to Predict Hardness of Sn-based Alloys
Vertically Stacked 2H-1T Dual-phase TMD Microstructures during Lithium Intercalation: A First Principles Study
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