| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Oxygen-Free Cu Sinter Joining in the Air on Cold-Rolled Cu Substrates |
| Author(s) |
YehRi Kim, Ha-Young Yu, Dongjin Kim |
| On-Site Speaker (Planned) |
YehRi Kim |
| Abstract Scope |
In response to wide band-gap semiconductor power modules, Cu sintering is emerging as a cost-effective interconnect technology compared to Ag sintering. However, the bonding process at temperatures exceeding 250 °C subjects the Cu to severe oxidation, which significantly degrades the mechanical, thermal, and electrical properties. In response, previous studies have proposed a protective sintering atmosphere to prevent the oxidation of Cu nanoparticles. Nevertheless, leading automobile OEMs are interested in improving price competitiveness and establishing a reliable structure through oxidation-free Cu sintering in the air atmosphere. This study conducted air-pressure-assisted Cu sintering at a temperature of 250 °C. Cold-rolled Cu substrates with various rolling rates were investigated to identify the potential driving force of Cu sintering. This study quantitatively analyzed the crystallographic behavior of the Cu-sintered joint structure involved in the rolling rates of the Cu substrates and the mechanism of bonding strength, considering the relationship between microstructures and mechanical behavior. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Joining, Mechanical Properties |