| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
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| Symposium
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Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXIV
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| Presentation Title |
Phase Equilibria, Solidification and Properties of Al-Cu-Ni-Sn Alloys |
| Author(s) |
Wen-yu Chang, Yung-Chun Tsai, Cheng-Hsi Ho, Sinn-wen Chen |
| On-Site Speaker (Planned) |
Yung-Chun Tsai |
| Abstract Scope |
Liquidus projections and isoplethal sections of the Al-Cu-Ni-Sn and its constituent ternary systems are examined. The solidification, mechanical properties, and corrosion properties of medium-entropy Al-Cu-Ni-Sn alloys are determined. Selected compositions of Al-Cu-Ni, Al-Cu-Sn, Al-Ni-Sn, and Al-Cu-Ni-Sn alloys are prepared. Their primary solidification phases and solidification paths are determined. The experimentally determined results are compared with those calculated using the Calphad approach with commercial databases. Inconsistencies are observed, and the phase diagrams are revised accordingly. Hardness testing results show that the hardness of the Al-Cu-Ni alloys ranges from 400 to 550 HV. Miscibility gaps are observed in the Al-Cu-Sn and Al-Ni-Sn systems, and the hardness differs significantly between the Sn phase and compound phases. In corrosion measurements, the corrosion potential of the alloys ranges from -0.06186 to 0.80445 V/cm², with the lowest observed in the Al-40 at.% Cu-20 at.% Ni-20 at.% Sn alloy and the highest in the Al-Ni-Sn ternary alloy. |
| Proceedings Inclusion? |
Planned: |