| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Comparative Research on Reliability Characteristics of Combined Pb-Free Solder Joints With Sn-Ag-Cu and Sn-Bi-Ag |
| Author(s) |
Jahyeon Kim, Taeyoon Im, Won Bin Im, Yong-Ho Ko |
| On-Site Speaker (Planned) |
Jahyeon Kim |
| Abstract Scope |
Sn3.0Ag0.5Cu (SAC305) Pb-free solder are widely used for excellent mechanical and electrical properties of various interconnects in electronic packages. However, SAC305 with a high-melting temperature can deteriorate joints reliability due to deformations of substrates during the bonding process. To suppress the deformations, many researches are being actively reported studies combining SAC305 and Sn-58Bi with a low-melting temperature. Because of brittle properties of Bi, Sn-Bi based solders with high-contents Bi can cause to weak strength and reliability of solder joints. In this study, we fabricated a combined Pb-free solder joints using SAC305 solder balls and Sn-57Bi-1Ag solder paste through various bonding methods. After the fabrication, during isothermal aging test, we investigated interfacial properties such as diffusions of Bi atoms and growths of intermetallic compounds (IMCs). We also evaluated shear strengths of joints and suggested improving method for joint properties of combined interconnects between SAC305 and Sn-57Bi-1Ag solders. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, |