| Abstract Scope |
Thermomigration (TM) in three-dimensional integrated circuits (3DICs) generates heat and causes temperature gradients that can lead to reliability issues in electronic packaging. To resist TM in solder joints, it is necessary to understand the migration process. FeCoNiMn (FCNM), a high entropy alloy, exhibits excellent thermal stability and is a promising atomic diffusion barrier to resist TM. This study investigated TM in Cu/Sn3.5Ag/FeCoNiMn (FCNM) solder joints at different temperatures and times. The research found that a (Cu, Mn, Fe, Co, Ni)6Sn5 MEIMC was formed at the SA3.5/FCNM interface, hindering Cu6Sn5 formation near the Cu/SA3.5 interface. However, the low chemical flux from FCNM prevented thickening of the MEIMC layer. The research demonstrates that FCNM is a suitable diffusion barrier for TM in solder microbumps and contributes to the development of new materials with improved TM resistance and reliability in electronic packaging, particularly in 3DICs. |