| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Microstructural Fingerprints for Secure Microelectronic Packaging |
| Author(s) |
Min Cho, Eshan Ganju, Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Min Cho |
| Abstract Scope |
Security in electronic packages has become important in recent years due to escalating problem of counterfeiting. We propose novel hierarchical microstructural fingerprint consisting of tantalum particles in a resin matrix that can be cured by x-rays. X-ray micro-tomography was used for curing as well as characterization of the random distribution of particles. In addition, we investigated the heterogeneity in curing using particle distributions from x-ray radiographs. Molecular dynamic simulator LIGGGHTS was further used to understand the interaction of particles in viscous fluid. The influence of shape of the particles, distribution of particles, and volume fraction on the “sinking velocity” of particles during curing will be discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Composites, Polymers, Modeling and Simulation |