About this Abstract |
Meeting |
2020 TMS Annual Meeting & Exhibition
|
Symposium
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Alloys and Compounds for Thermoelectric and Solar Cell Applications VIII
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Presentation Title |
High Reliability Package of Perovskite Solar Cell by SiNx Passivation Layer with Sn-Bi-In Low-melting Solder |
Author(s) |
Chun Kai Huang |
On-Site Speaker (Planned) |
Chun Kai Huang |
Abstract Scope |
Due to highly active of iodine ion, perovskite solar cell (MAPbI3) cannot withstand reflow temperature over 100℃ during package process. Therefore, low melting temperature of Sn-Bi-In solder was a promising material for the application on perovskite solar cell package. However, thin-film electrode of solar cell will be consumed during reflowing process, which is a great challenge to stability of perovskite solar cell. In this study, additional SiNx passivation layer and Ti/Ag metallization layers were deposited on electrode and enhanced 2.75 times lifetime of perovskite solar cell under atmosphere. We suggested that SiNx layer effectively avoided the solder diffusion to the Ag electrode and preventing the MAPbI3 from the environment. In addition, the mechanism of Sn-Bi-In solder bonding on SiNx layer will be further discussed. With proper packing structure, as-packing solar cell remains 94.1 % efficiency and 85.4 % efficiency after 24 hour sinking-water reliability test. |
Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |