| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
D-1 (Invited): Effects of Materials and Package Design on Warpage Control of Semiconductor Devices |
| Author(s) |
Richard Chung, Hala Shaba |
| On-Site Speaker (Planned) |
Richard Chung |
| Abstract Scope |
Warpage of microelectronic devices is a critical design parameter to consider during the package design phase to ensure a robust device assembly process and reliable devices. Warpage deformation results from thermal stress buildup in the package due to selection of molding compounds and their material properties, substrate design and properties, silicon die size and package dimensions needs to be understood to meet certain warpage target requirements. The aim of this project is to compare different material properties and thicknesses of molding compounds to investigate their impact on controlling warpage of a small ball grid array prototype packages. Thermo-mechanical modeling and simulations are conducted to help guide selecting the molding compound material properties. The selection of the molding compound with relatively higher CTE, higher Tg and thicker package design helped control the warpage of this package structure and successfully maintained warpage below 100 µm. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |