| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Materials Processing Fundamentals: Thermodynamics and Rate Phenomena
|
| Presentation Title |
Understanding enhancing Al/Cu spot welding joint performance with an Ag interlayer |
| Author(s) |
Shuang Lin, Kyubok Lee, Shun-Li Shang, Allison Beese, Jingjing Li, Zi-Kui Liu |
| On-Site Speaker (Planned) |
Shuang Lin |
| Abstract Scope |
The present work explores the performance of Al/Cu joints with an Ag layer between Al and Cu in the spot-welding process. The introduced Ag layer aims to prevent the formation of brittle intermetallic compounds (IMCs) such as Al₂Cu and Al₄Cu₉, which can significantly degrade joint performance. This study employs the CALculation of PHAse Diagrams (CALPHAD) method to understand phase stability of the interfaces between Al-Ag and Ag-Cu during the solidification process, validated by experimental measurements. The Pugh criterion (Bulk modulus/Shear modulus) and Cauchy pressure (C₁₂ - C₄₄) are used to understand the ductility of the Al-Ag IMCs and solid solutions, which were predicted by elastic constants at finite temperature in terms of first-principles calculations. The present work indicates that the less brittle IMCs can be formed by introducing an Ag interlayer, resulting in enhanced Al/Cu joint performance. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Modeling and Simulation, |