About this Abstract |
Meeting |
Additive Manufacturing Benchmarks 2022 (AM-Bench 2022)
|
Symposium
|
Additive Manufacturing Benchmarks 2022 (AM-Bench 2022)
|
Presentation Title |
A Rheological Approach for Measuring Cure Depth of Filled and Unfilled Photopolymers at Additive Manufacturing Relevant Length Scales |
Author(s) |
Daniel A. Rau, John P. Reynolds, Jackson S. Bryant , Michael J. Bortner, Christopher B. Williams |
On-Site Speaker (Planned) |
Daniel A. Rau |
Abstract Scope |
We introduce a novel experimental method that uses a UV photorheometer to enable accurate and repeatable measurements of photocured films thinner than 50 μm to create working curve equations. This technique enables measurement of a wide range of photopolymers at additive manufacturing (AM) process-relevant cure depths with process-relevant irradiance and wavelengths and has applications in advanced material development for both AM and traditional UV processing technologies. A rheometer equipped with a photocuring attachment delivers ultraviolet (UV) irradiation to a photoresin and cures a thin film. The thickness of the resultant film is measured by lowering the rheometer’s upper plate and monitoring the axial force on the plate. Our technique correlates encoder measured distance with axial force to measure cure depth under different UV curing conditions. This method could be used as an industry standard for measuring cure depths and creating system-independent working curves. |
Proceedings Inclusion? |
Undecided |