| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior Related to Interface Physics IV
|
| Presentation Title |
In-Situ Characterization of Interface Properties as well as Modelling of Crack-Steering Processes in Nano-Scale Multi-Layer and Multi-Material Composite Stacks in Microelectronics |
| Author(s) |
André Clausner, Stefan Weitz, Jendrik Silomon, Kristina Kutukova |
| On-Site Speaker (Planned) |
André Clausner |
| Abstract Scope |
In modern microelectronics, the on-chip interconnects - the so-called Back-End-of-Line (BEoL) - are complex and fragile multi-layer, multi-interface, multi-material, and multi-scale composite stacks. A deep understanding of their interfacial crack propagation properties as well as of the mechanics of internal crack steering designs is crucial for the reliability of those systems. Therefore, in this study novel and advanced strategies are presented for high-resolution in-situ X-ray microscopy (XRM) crack path observation including quantitative interface adhesion characterization. Based on these in-situ XRM studies, numerical models of the material stacks and interfaces are created to study the (cross-) interfacial crack evolution. Furthermore, the fracture mechanics as an interplay between nano-scale interface properties and scale-depended plasticity of the involved stack-metals is studied as well as crack steering possibilities using specific design features in the BEoL. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Modeling and Simulation, Thin Films and Interfaces |