| Abstract Scope |
With the rapid development of the electronics industry in recent years, the line width of ICs has been continuously miniaturized. With the shrinking of the line width, the size of the material is gradually approaching the physical limit and makes semiconductors face great challenges in the packaging process, resulting in a miniaturization of the packaging structure (finer pitch, smaller size pad and), so it was essential to develop fine-pitch solder bumps for electrical interconnections.However, traditional method for bumping process such as stencil printing , solder jetting , microball placement and electroplating have faced on some problems (equipment limitation, process complexity, materials chose limitation and higher coast). To overcome these problems, we have developed a Self-organization assembly solder resin. By adding a special additive X, we can control the solder powder particles to precisely moving, coalescence and wetting on pads and forming interconnections in fine pitch structure during reflow process. |