| About this Abstract |
| Meeting |
MS&T24: Materials Science & Technology
|
| Symposium
|
2024 Graduate Student Poster Contest
|
| Presentation Title |
SPG-23: Grain Boundary Strength of High Thermal Conductivity Si3N4 Ceramics Measured Using Microcantilever Beam Specimens |
| Author(s) |
Komaki Matsuura, Junichi Tatami, Motoyuki Iijima, Tatsuki Ohji, Takuma Takahashi |
| On-Site Speaker (Planned) |
Komaki Matsuura |
| Abstract Scope |
Understanding the mechanical properties of grain boundary in Si3N4 ceramics is important to fabricate highly reliable ceramics. In this study, the grain boundary strengths of high thermal conductivity Si3N4 ceramics doped with 3 wt% RE2O3 (RE=Y, La, or Lu) and 7 wt% MgO were measured by bending test using microcantilever beam specimens. The thermal conductivity of the Si3N4 ceramics doped with Y2O3 and MgO was higher than that with the other additives. The strength depended on the type of RE2O3 and increased in order of Y < La < Lu.
This tendency was attributed not only to the difference in the amount of the rare earth ions at the interface between the intergranular glassy film and the Si3N4 grain, but also to the oxygen content in the Si3N4 grains, which is related to thermal conductivity. |