| Abstract Scope |
Various commercial systems print high-performance thermoplastics such as polyetherimide (PEI) and polyetheretherketone (PEEK) for medical implants, aerospace, automotive, and electrical components. Superior to common fused deposition modeling (FDM) materials, these polymers have advantageous chemical resistance, heat resistance, and mechanical properties. However, high temperature printing (e.g., chamber temperature of 150ºC) poses challenges in FDM. Most commercial systems for these materials are costly and lack modularity. This project aims to develop an open-source, modular, high-temperature, FDM 3D printer for high-performance thermoplastics that is easily constructed and user-friendly. It uses readily available materials, a Duet3D motherboard, and RepRap firmware for easy customization. The printer accommodates a 500ºC nozzle temperature, bed temperature of 250ºC, and chamber temperature of 200ºC. Its modularity allows for additional sensors to monitor printing parameters, including IR cameras for evaluation of thermal gradients. With open-source software, users can modify printing parameters to analyze their sensitivity on mechanical properties. |