| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Effect of Bi and Zn Addition to the Properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni Solder Coating |
| Author(s) |
Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Hideyuki Yasuda, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Kazuhiro Nogita |
| Abstract Scope |
This paper investigates the effect of Bi and Zn addition on Sn-0.7Cu and Sn-0.7Cu-0.05Ni solder coating properties for surface finish application. This solder coating has two essential functions, to protect the exposed copper and to provide a solderable surface when soldering the component. This understanding of the interfacial intermetallic kinetic and free solder thickness between the solder and substrate is important for maximizing the service life of solder joints. The IMC thickness and the growth rate of solder coating of Sn-0.7Cu and Sn-0.7Cu-0.05Ni solder coating have been studied. This research also explores the formation and the growth kinetics of primary intermetallics by using real-time imaging technology to study the influence of Bi and Zn on the primary IMCs in Sn-0.7Cu and Sn-0.7Cu-0.05Ni solder coating during the solidification process. The morphology and distribution of the IMC formed during the soldering process will dramatically affect the solderability properties of the solder joints. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |