| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
A Study on Novel Thermal Interface Composite Indium-Based/Diamond Composite for High-Performance Computing Applications |
| Author(s) |
Yuan-Han Ku, Wei-Chen Huang, Pei-Tsen Heish, C. Robert Kao |
| On-Site Speaker (Planned) |
Yuan-Han Ku |
| Abstract Scope |
With the rapid development of high-performance computing chips, the issue of "thermal accumulation" in electronic devices has significantly increased. Small chip sizes result in surface temperatures comparable to the sun, causing device failure. Developing new thermal interface materials to enhance thermal conductivity is crucial for high-power density chip management. Nowadays, indium with its high thermal conductivity, is used to demonstrate thermal performance for high power consumption. However, pursuing more effective heat dissipation has become a challenge for the safe operation of electronic devices. Recently, diamond metal matrix composites with high thermal conductivity have received extensive attention. This study investigates indium-based/diamond composites is one of the newly developed thermal interface materials, focusing on the effects of diamond powder concentration, particle size, and coating on thermal conductivity. Cross-sectional morphology of interfacial wetting and thermal shock behavior are also analyzed, providing novel insights and detailed data for high-performance computing chip reliability. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Composites, Surface Modification and Coatings, Other |